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MB39C326 6 mhz synchronous rectification buck - boost dc/dc converter ic cypress semic onductor corporation ? 198 champion court ? san jose, ca 95134 - 1709 ? 408 - 943 - 2600 document number: 002 - 08348 rev. *b revised may 11, 2017 description the MB39C326 is a high efficiency, low noise synchronous, buck - boost dc/dc converter designed for powering the radio frequency power amplifiers (rfpa) in 3g/gsm mobile handsets and other mobile applications. features ? high efficiency : up t o 93 % ? input voltage range : 2.5 v to 5.5 v ? adjustable output voltage range : 0.8 v to 5.0 v ? maximum output current (buck, pwm mode) : 1200 ma (v in = 5.0 v to 5.5 v, at vo=5.0 v) : 1200 ma (v in = 3.6 v to 5.5 v, at vo=3.6 v) : 1200 ma (v i n = 3.3 v to 5.5 v, at vo=3.3 v) (boost, pwm mode) : 900 ma (v in = 3.7 v to 5.0 v, at vo=5.0 v) : 700 ma (v in = 2.5 v to 3.6 v, at vo=3.6 v) : 800 ma (v in = 2.5 v to 3.3 v, at vo=3.3 v) (buck, power save mode, : 600 ma (v in = 5.0 v to 5. 5 v, at vo=5.0 v) ilimsel=h) : 600 ma (v in = 3.6 v to 5.5 v, at vo=3.6 v) : 600 ma (v in = 3.3 v to 5.5 v, at vo=3.3 v) (boost, power save mode, : 500 ma (v in = 3.7 v to 5.0 v, at vo=5.0 v) ilimsel=h) : 400 ma (v in = 2.5 v to 3.6 v, at vo=3 .6 v) : 500 ma (v in = 2.5 v to 3.3 v, at vo=3.3 v) ? quiescent current : 50 a ? 6 mhz pwm operation allows 0.5 h small form inductor ? automatic transition between buck mode and boost mode ? power save mode for improved efficiency at light load current ? sel ectable output voltage with external resistor ? built - in over temperature protection circuit ? built - in under voltage lockout protection circuit ? package : wl - csp (20 pin 0.4 mm - ball - pitch 2.15 1.94 mm) applications ? products that use 1 - cell lithium batteries for the power supply ? rf power amplifier ? cell - phone ? rf - pc card and pda note: this product supports the web - based design simulation tool, easy designsim. it can easily select external components and can display useful information. please access from http://cypress.transim.com/login.aspx
document number: 002 - 08348 rev. *b page 2 of 22 MB39C326 contents description ................................ ................................ ................................ ................................ .............................. 1 features ................................ ................................ ................................ ................................ ................................ .. 1 applications ................................ ................................ ................................ ................................ ............................ 1 1. pin assignments ................................ ................................ ................................ ................................ .......... 3 2. pin descriptions ................................ ................................ ................................ ................................ .......... 3 3. block diagram ................................ ................................ ................................ ................................ ............. 4 4. function ................................ ................................ ................................ ................................ ....................... 4 5. absolute maximum ratings ................................ ................................ ................................ ......................... 6 6. recommended operating conditions ................................ ................................ ................................ ......... 6 7. electrical characteristics ................................ ................................ ................................ ............................. 8 8. typical ap plications circuit (rf power amplifier) ................................ ................................ ....................... 9 9. application notes ................................ ................................ ................................ ................................ ...... 10 10. inductor selection ................................ ................................ ................................ ................................ ...... 12 11. input capacitor selection ................................ ................................ ................................ .......................... 12 12. output capacitor selection ................................ ................................ ................................ ....................... 12 13. thermal information ................................ ................................ ................................ ................................ .. 12 14. notes on board layout ................................ ................................ ................................ .............................. 13 15. example of standard operation characteristics ................................ ................................ ....................... 14 16. usage precaution ................................ ................................ ................................ ................................ ...... 17 17. notes on mounting ................................ ................................ ................................ ................................ .... 17 18. ordering information ................................ ................................ ................................ ................................ . 18 19. rohs compliance information ................................ ................................ ................................ .................. 18 20. package dimensions ................................ ................................ ................................ ................................ . 19 21. major changes ................................ ................................ ................................ ................................ .......... 20 document history ................................ ................................ ................................ ................................ ................. 21 sales, solutions, and legal information ................................ ................................ ................................ ............... 22
document number: 002 - 08348 rev. *b page 3 of 22 MB39C326 1. p in a ssignments (u4d020) 2. p in descriptions pin no. pin name i/o description a4 en i ic enable input pin (h: e nable, l: shutdown) e3 fb i voltage feedback pin c3, d3, e4 gnd - control / l ogic ground pins b4 ilimsel i inductor peak c urrent limit pin b1, b2 swout i connection pins for inductor d1, d2 swin i connection pins for inductor c1, c2 dgnd - power ground pins c4 vsel i output v oltage select pin (h: using r3 l: no using r3) d4 vselsw - connection pin for output voltage setting resistor r3 a1, a2 vdd i electric power input pin for dcdc converter output voltage a3 vcc i electric power input pin for ic control block b3 xps i p ow er save mode pin (h: pwm mode, l: power save mode) e1, e2 vout o buck - boost converter output pins t o p view vdd swou t dgnd swin vou t vdd swou t dgnd swin vou t vcc xps gnd gnd fb en ilimse l vse l vselsw gnd a b c d e 4 3 2 1
document number: 002 - 08348 rev. *b page 4 of 22 MB39C326 3. b lock d iagram 4. f unction (1) gate controller it is controlled the synchronous rectification operation of built - in 2 - p - ch mos fets and 2 - n - ch mos fets according to frequency (6 mhz) set with a oscillator at the normal operation. (2) error amp & phase compensation circuit this compares the feedback voltage and the reference voltage (vref). this ic contains the phase compensation circuit which optimizes the ic operation. therefore, it is unnecessary to consideration of the phase compensation circ uit, and external parts for the phase compensation. (3) band gap reference circuit a high accuracy reference voltage is generated with bgr (band gap reference) circuit. (4) oscillator the internal oscillator output a 6 mhz clock signal to set a switching f requency. (5) over temperature protection circuit the over temperature protection circuit is built - in as a protection circuit. when junction temperature reaches + 125 c, the over temperature protection circuit turns off all n - ch mos fets and p - ch mos fets. also, when the junction temperature falls to + 110 c, this ic operates normally. ( 6 ) inductor peak current limit circuit (current sensor + device control) the inductor peak current limit circuit detects the current (i lx ) which flows from built - in p - ch mos fet connected to vdd into an external inductor and limits t he inductor peak current (i pk ) . v b a t t g a t e c o n t r o l l e r s w 1 s w 3 s w 2 s w 4 s w o u t s w i n v d d v o u t v c c b g r uv l o f b e n a g n d d g n d d e v i c e c o n t r o l o v e r t e m p p r o t e c t i o n o s c il l at o r c u r r en t s e n s o r c i n c o u t l 1 r 1 r 2 e r r a m p r 3 v s e l v s el s w i l i m s e l x p s sw 5
document number: 002 - 08348 rev. *b page 5 of 22 MB39C326 ( 7 ) power save mode operation power save mode is used to improve efficiency at the light load. by setting the xps pin to " l " level, power save mode is set and th e operation is performed in pwm mode or pfm mode depending on the load current. at this time, if the load current is low, thi s ic operates with pfm (pulsefrequency modulation). it should be used above v out = 0.8 v. if the output voltage becomes lower than the setting value at the light load, switching is performed several times and the output voltage rises. if the output voltage reaches the setting value, it changes to the stop state, all of the four fets are turned off, and the switching loss and the dissi pation power for the circuit are suppressed. consumption current in stop state at the power save mode becomes about 50 a. ? function t able mode xps ilimsel input v oltage r ange[v] output v oltage r ange[v] inductor peak c urrent l imit (i pk ) [a] min max min max pwm mode h l 2.5 5.5 0.8 5.0 3.1 power save mode l h 1.3 l 0.49 note: input of (xps, ilimsel = h, h) is prohibited. ( 8 ) en pin when the en pin is set to "h" level, the device operation is enabled. when the en pin is set to gnd, the devi ce is switched to shutdown mode. when the en pin is set to " l " level, the device is switched to shutdown mode. in shutdown mode, the regulator stops switching, all fet switches are turned off, and the load is disconnected from the input . (9) vsel pin mb39c 326 has a function to change the output voltage with the vsel pin and additional resistance. for details of the output voltage settings, see the section 2 . of "programming the output volt age" in 9 . a pplication . (10) buck - boost operations MB39C326 operates in buck or boost mode by monitoring the vcc/vout voltage with a newly developed pwm controller. the transition between buck and boost mode is smooth and the efficiency is high. during buck mode (vcc > vout), sw1 and sw2 perform switching while sw3 is fixed to off and sw4 and 5 are fixed to on. during boost mode (vcc < vout), sw3, sw4 and sw5 perform switching while sw1 is fixe d to on and sw2 is fixed to off. the voltage values of vcc and vdd at the switching between buck and boost vary depending on the load current, the environmental temperature and the process variations. (11) startup circuit MB39C326 has the soft - start functi on to prevent rush current upon turning on of the power. the startup time is approximately 100 s.
document number: 002 - 08348 rev. *b page 6 of 22 MB39C326 5. a bsolute m aximum r atings parameter symbol condition rating unit min max power supply voltage v max vdd, vcc - 0.3 +7.0 v signal input voltage v inmax en , xps, vsel, ilimsel - 0.3 v dd + 0.3 v power dissipation p d ta +25 c - 1080 mw storage temperature t stg - - 65 +150 c esd voltage v esdh human body model (100 pf, 1.5 k) - 2 000 + 2 000 v v esdm machine model (200 pf, 0) - 200 + 200 v v esdc charged device model - 1000 +1000 v maximum junction temperature tj - max - - +95 c warning: semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage, current or temperature) in excess of absolute maximum ratings. do not exceed any of these ratings. 6. r ecommended o perating c onditions parameter symbol condition value unit m in t yp max power supply voltage v dd vdd, vcc 2.5(*1) 3.7 5.5 ( * 1) v signal input voltage v idd en, xps, vsel, ilimsel 0.0 - v dd v output current ( buck ) pwm mode io (max1) v in = 5.5, vo = 5.0v, xps = h , ilimsel = l - - 1200 ma io (max2) v in = 5.5, vo = 4.4v, xps = h, ilimsel = l - - 1200 ma io (max3) v in = 5.5, vo = 3.6v, xps = h, ilimsel = l - - 1200 ma v in = 4.2, vo = 3.6v, xps = h, ilimsel = l - - 1200 ma io (max4) v in = 5.5, vo = 3.3v, xps = h, ilimsel = l - - 1200 ma v in = 3.7, vo = 3.3v, xps = h, ilimsel = l - - 1200 ma io (max5) v in = 5.5, vo = 2.0v, xps = h, ilimsel = l - - 1200 ma v in = 3.7, vo = 2.0v, xps = h, ilimsel = l - - 1200 ma v in = 2.5, vo =2 .0v, xps = h, ilimsel = l - - 1200 ma io (max6) v in = 5.5, vo = 1.2v, xps = h, ilimsel = l - - 700 ma v in = 3.7, vo = 1.2v, xps = h, ilimsel = l - - 600 ma v in = 2.5, vo = 1.2v, xps = h, ilimsel = l - - 600 ma io (max7) v in = 5.5, vo = 0.8v, xps = h, ilimsel = l - - 60 0 ma v in = 3.7, vo = 0.8v, xps = h, ilimsel = l - - 500 ma v in = 2.5, vo = 0.8v, xps = h, ilimsel = l - - 250 ma output current (boost) pwm mode io (max8) v in = 2.5v, vo = 3.3v, xps = h, ilimsel = l - - 800 ma io (max 9 ) v in = 2.5v, vo = 3.6v, xps = h, ilimsel = l - - 700 ma io (max10) v in = 3.7v, vo = 4.4v, xps = h, ilimsel = l - - 1000 ma v in = 2.5v, vo = 4.4v, xps = h, ilimsel = l - - 700 ma io (max1 1 ) v in = 3.7v, vo = 5v, xps = h, ilimsel = l - - 900 ma v in = 2.5v, vo = 5v, xps = h, il imsel = l - - 600 ma
document number: 002 - 08348 rev. *b page 7 of 22 MB39C326 parameter symbol condition value unit m in t yp max output current ( buck ) power s ave mode , ilimsel=h io (max12) v in = 5.5, vo = 5.0v, xps = l, ilimsel = h - - 600 ma io (max 13 ) v in = 5.5, vo = 4.4v, xps = l, ilimsel = h - - 600 ma io (max1 4 ) v in = 5.5, vo = 3.6v, xps = l, ilimsel = h - - 600 ma v in = 4.2, vo = 3.6v, xps = l, ilimsel = h - - 600 ma io (max1 5 ) v in = 5.5, vo = 3.3v, xps = l, ilimsel = h - - 600 ma v in = 3.7, vo = 3.3v, xps = l, ilimsel = h - - 600 ma io (max1 6 ) v in = 5.5, vo = 2.0v, xps = l, ilimsel = h - - 600 ma v in = 3.7, vo = 2.0v, xps = l, ilimsel = h - - 500 ma v in = 2.5, vo = 2.0v, xps = l, ilimsel = h - - 500 ma io (max1 7 ) v in = 5.5, vo = 1.2v, xps = l, ilimsel = h - - 400 ma v in = 3.7 , vo = 1.2v, xps = l, ilimsel = h - - 300 ma v in = 2.5, vo = 1.2v, xps = l, ilimsel = h - - 300 ma io (max1 8 ) v in = 5.5, vo = 0.8v, xps = l, ilimsel = h - - 400 ma v in = 3.7, vo = 0.8v, xps = l, ilimsel = h - - 200 ma v in = 2.5, vo = 0.8v, xps = l, ilimsel = h - - 200 ma output current (boost) power s ave mode , ilimsel=h io (max19) v in = 2.5v, vo = 3.3v, xps = l, ilimsel = h - - 500 ma io (max20) v in = 2.5v, vo = 3.6v, xps = l, ilimsel = h - - 400 ma io (max21) v in = 3.7v, vo = 4.4v, xps = l, ilimsel = h - - 600 ma v in = 2.5v, vo = 4.4v, xps = l, ilimsel = h - - 350 ma io (max22) v in = 3.7v, vo = 5v, xps = l, ilimsel = h - - 500 ma v in = 2.5v, vo = 5v, xps = l, ilimsel = h - - 300 ma output current (b uck ) power s ave mode, ilimsel= l io (max2 3 ) v in = 3.7, vo = 3.3v, xps = l, ilimsel = l - - 1 6 0 ma output current (boost) power save mode, ilimsel= l io (max2 4 ) v in = 2 . 5 , vo = 5 v, xps = l, ilimsel = l - - 6 0 ma operating ambient temperature ta - - 40 - + 85 c junction temperature range tj - - 40 - +95 c inductor value l - - 0.5 - h feedback resistor value r1 - - 620 - k *1: depending on the setting condition. see " function table" in "4. function (7) power save mode operation". warning: 1. the recommended operating conditions are requir ed in order to ensure the normal operation of the semiconductor device. all of the device's electrical characteristics are warranted when the device is operated under these conditions. 2. any use of semiconductor devices will be under their recommended opera ting condition. 3. operation under any conditions other than these conditions may adversely affect reliability of device and could result in dev ice failure. 4. no warranty is made with respect to any use, operating conditions or combinations not represented on this data sheet. if you are considering application under any conditions other than listed herein, please contact sales representatives beforehand.
document number: 002 - 08348 rev. *b page 8 of 22 MB39C326 7. e lectrical c haracteristics the specifications apply under the recommended operating condition. parameter s ymbol condition value unit min typ max output voltage range v o - 0.8 - 5.0 v feedback voltage v fb - 490 500 510 mv line regulation v line i o = 0 to 800 ma - 0.2 - % load regulation v load i o = 0 to 800 ma - 0.3 - % inductor peak current limit i pk x ps = h, ilimsel = l 2.50 3.10 3.75 a xps = l, ilimsel = h 1.05 1.30 1.60 a xps = l, ilimsel = l 0.36 0.49 0.60 a oscillation frequency f osc - 5.2 5.8 6.4 mhz shutdown current i sd en = l - - 2 a quiescent current i q en = h, xps = l, v in = 3.7v, v o = 3.3v, i o = 0 ma - 50 - a sw fet on resistance sw1 rdson v dd = 3.7v, v o = 3.3v, ta = +25c - 63.5 84 m sw2 - 124 175 sw3 - 82 116 sw4 - 123 164 sw5 - 51 72 over temperature protection t otph - - 135 (*1) - c t otpl - - 110 ( * 1) - c uvlo threshold voltage v uvloh - 1.9 2 .0 2.1 v v uvlol - 1.8 1.9 2.0 v signal input threshold voltage v il en, xps, vsel, ilimsel 0 .0 - 0.25 v v ih en, xps, vsel, ilimsel 1.5 - vdd v signal input current i ctl en, xps, vsel, ilimsel - - 0.1 a * 1 : th is parameter is not be specified. this should be use d as a reference to support designing the circuits.
document number: 002 - 08348 rev. *b page 9 of 22 MB39C326 8. t ypical a pplications c ircuit (rf power a mplifier ) c i n 1 0 f v b a t t v o d a c 0 . 5 h s w i n s w o u t p a c o u t 2 . 2 f m b 3 9 c 3 2 6 p o u t p i n v s e l v c c e n v d d a g n d v s e l s w f b v o u t d g n d
document number: 002 - 08348 rev. *b page 10 of 22 MB39C326 9. a pplication n otes programming the output voltage output voltage is calculated using the equatio n (1) below. use r1 resistor value of 620 k. built - in phase compensation circuit is generated according to this resistor value. 1. not using a selectable voltage option v o = v fb r 1 + r 2 r 2 (v fb = 500 mv) 2. usin g a selectable voltage option when vsel = l v o = v fb r 1 + r 2 r 2 when vsel = h v o = v fb r 1 + ( r 2 // r 3 ) r 2 // r 3 l or h v b a t t c in c ou t v o swou t l1 vdd vcc en xps vse l ilimse l gnd swin vou t fb vselsw dgnd r1 r2 l1 swou t swin vdd vcc en xps vse l ilimse l gnd r1 r2 r3 vou t v o c ou t fb vselsw dgnd v b a t t c in
document number: 002 - 08348 rev. *b page 11 of 22 MB39C326 3. when the output variable is dynamically performed v o = - r 1 v dac + v fb ( r 1 + r 1 +1) r 3 r 3 r 2 (v fb = 500 mv) relationship between dac and output when setting to r1 = 620 k, r2 = 110 k and r3 = 330 k swou t swin vdd vcc en xps vse l ilimse l gnd r1 r2 dac r3 vou t v o c ou t fb vselsw dgnd v b a t t c in v o - dac 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 0.000 0.500 1.000 1.500 2.000 2.500 dac voltage (v) v o (v)
document number: 002 - 08348 rev. *b page 12 of 22 MB39C326 10. i nductor s election the recommended inductor is 0.5 h (0.47 h). to acquire a high - effici ency, select an inductor with low esr. confirm in use conditions that the coil current does not exceed the rated saturation current. it is recommended that the switch current limit value is considered. note that the permissible current value might be low a bout some products with high esr because of the device temperature increasing . the following table shows the recommended inductor. vendor part # size dcr [ ] (max) isat [a] ( - 30%) l [mm] w [mm] h [mm] coilcraft xpl2010 - 501ml 1.9 2.0 1.0 0.045 2.64 alps glchkr4701a 2.0 1.6 1.0 0.035 3. 6 coilcraft : coilcraft, inc. alps : alps green devices co., ltd 11. i nput c apacitor s election it is recommended to place a l ow esr ceramic bypass capacitor at least 10 f close to vdd and gnd because the input capacitor is the power - supply voltage. the execution capacity of some ceramic capacitors greatly decreases when adding bias. select a product by checking the part charact eristics of manufacturer because small size parts or low voltage rating parts t end to have that characteristic . 12. o utput c apacitor s election the recommended standard capacity of the output capacitor is 2.2 f in pwm mode. when using in power save mode, the c apacitor with larger capacity (around 22 f) is recommended to reduce the ripple voltage at pfm operation . to suppress the decrease of output voltage during the load change, adjust with a larger capacitor. larger capacitors and low esr capacitors is useful to reduce the ripple. 13. t hermal i nformation power dissipation is 1080 mw max . thermal resistance (ja) is 65 c /w (jedec). this value can be used to calculate the chip temperature. thermal resistance is calculated based on the usage of jedec standard boards. it is recommended to consider for the thermal design that the value may vary depending on the area of the board and the positions of the vias. see "power dissipation vs. operation ambient temperature" in " 15 . e xample of s tandard o peration ".
document number: 002 - 08348 rev. *b page 13 of 22 MB39C326 14. n otes on b oard l ayout a suitable board layout is required for stable operations of this ic. place the peripheral component, input capacitance c in and the output capacitance c out close to this ic as much as possib le, and connect them with the shortest routes. the routes with large current, in particular, the routes with variable current must be placed on the front surface with the s hortest routes. separate dgnd from gnd and connect gnd at one point close to c out . p rovide the ground plane as much as possible on the ic mounted face. it is useful for heat dissipation. vdd l c c c c c r r r vcc fb v out dgnd
document number: 002 - 08348 rev. *b page 14 of 22 MB39C326 15. e xample of s tandard o peration c haracteristics efficiency vs. load current (v in = 3.7v, pwm mode) efficiency vs. load current (v in = 3.7v, power save mode, ilimsel=h) efficiency [%] efficiency [%] load current (a) load current (a) efficiency vs. load current (v o = 3.3v, pwm mode) efficiency vs. lo ad current (v o = 3.3v, power save mode, ilimsel=h) efficiency [%] efficiency [%] load current (a) load current (a) efficiency vs. load current (v o = 5.0v, pwm mode) efficiency vs. load current (v o = 5.0v, power save mode, ilimsel= h) efficiency [%] efficiency [%] load current (a) load current (a) 1 0 0 % 9 0 % 8 0 % 7 0 % 6 0 % 5 0 % 4 0 % 3 0 % 2 0 % 1 0 % 0 % 0 . 0 0 1 0 . 0 1 0 0 . 1 0 0 1 . 0 0 0 5 . 5 v 3 . 7 v 2 . 5 v x p s = h i l i m s e l = l i n p u t v o l t a g e = 1 0 0 % 9 0 % 8 0 % 7 0 % 6 0 % 5 0 % 4 0 % 3 0 % 2 0 % 1 0 % 0 % 0 . 0 0 1 0 . 0 1 0 0 . 1 0 0 1 . 0 0 0 5 . 5 v 3 . 7 v 2 . 5 v x p s = l i l i m s e l = h i n p u t v o l t a g e = 1 0 0 % 9 0 % 8 0 % 7 0 % 6 0 % 5 0 % 4 0 % 3 0 % 2 0 % 1 0 % 0 % 0 . 0 0 1 0 . 0 1 0 0 . 1 0 0 1 . 0 0 0 5 . 5 v 3 . 7 v 2 . 5 v x p s = h i l i m s e l = l i n p u t v o l t a g e = 1 0 0 % 9 0 % 8 0 % 7 0 % 6 0 % 5 0 % 4 0 % 3 0 % 2 0 % 1 0 % 0 % 0 . 0 0 1 0 . 0 1 0 0 . 1 0 0 1 . 0 0 0 5 . 5 v 3 . 7 v 2 . 5 v x p s = l i l i m s e l = h i n p u t v o l t a g e =
document number: 002 - 08348 rev. *b page 15 of 22 MB39C326 maximum output current vs. input voltage (pwm mode) maximum output current vs. input voltage (power save mode, ilimsel=h) maximum output current (a) maximum output current (a) input voltage [v] input voltage [v] load sudden change waveform startup (pwm mode) startup (power save mode, ilimsel=h) 1 100s/div v in =3.7v i o =0 0.4a c out =2.2f xps=h, ilimsel=l v o , 100mv/div, ac output current, 200ma/div 20s/div v in =3.7v, v o =3.3v, i o =0a xps=h ilimsel=l 20s/div en, 2v/div v o , 1v/div v in =3.7v, v o =3.3v, i o =0a xps=l ilimsel=h 20s/div 20s/div en, 2v/div v o , 1v/div
document number: 002 - 08348 rev. *b page 16 of 22 MB39C326 v o step response (rise) v o step response (fall) power consumption vs. operating ambient temperature pd [w] temperature [c] v in =3.7v, v o =0.8v4.0v rload=11 xps=h ilimsel=l 10s/div v o , 1v/div dac, 2v/div 10s/div v in =3.7v, v o =4.0v0.8v rload=11 xps=h ilimsel=l 10s/div v o , 1v/div dac, 2v/div 10s/div
document number: 002 - 08348 rev. *b page 17 of 22 MB39C326 16. u sage p recaution ? do not configure the ic over the maximum ratings . i f the i c is used over the maximum ratings, the ls i may be permanently damaged. it is preferable for th e device to be normally operated within the recommended usage conditions. usage outside of these condi tions can have a bad effect on the reliability of the lsi. ? use the devices within recommended operating conditions . the recommended o perating conditions are the recommended values that guarantee the normal operations of lsi. the electrical ratings are guaranteed when the device is used within the recommended operating conditions and under the conditions stated for each item. ? printed cir cuit board ground lines should be set up with consideration for common impedance . ? take appropriate measures against static electricity . ? containers for semiconductor materials should have anti - static protection or be made of conductive material. ? after mount ing, printed circuit boards should be stored and shipped in conductive bags or containers. ? work platforms, tools, and instruments should be properly grounded. ? working personnel should be grounded with resistance of 250 k to 1 m in series between body and ground. ? do not apply negative voltages . the use of negative voltages below - 0.3v may cause the parasitic transistor to be activated on lsi lines, which can cause malfunctions. 17. n otes on m ounting in general, the underfill material and sealing method affect the reliability of mounting. cypress does not evaluate the mounting using the underfill material. it is advisable for each customer to evaluate the mounting enough. wl - csp has a surface boundary between silicon and resin at the side of the package. resin m ay be pulled by the board because of the underfill material and its shape and the state, and stress may occur at the surface boundary. the result may vary depending on the board and the underfill material used by each customer; therefore, it is advisable f or each customer to evaluate the mounting enough in order to apply to the products. when using the underfill materials, be sure to apply th e underfill to the silicon side surface as shown below (fillet formation). ensuring wettability of the silicon underfill fillet silicon resin underfill
document number: 002 - 08348 rev. *b page 18 of 22 MB39C326 18. o rdering i nformation part num ber package remarks MB39C326pw 20 - pin plastic wl - csp ( u4d020 ) C 19. rohs c ompliance i nformation the lsi products of cypress with "e1" are compliant with rohs directive, and has observed the standard of lead, cadmium, mercury, hexavalent chromium, polybromin ated biphenyls (pbb), and polybrominated diphenyl ethers (pbde). a product whose part number has trailing characters "e1" is rohs compliant.
document number: 002 - 08348 rev. *b page 19 of 22 MB39C326 20. p ackage d imensions package code: u4d020 002 - 16171 rev. **
document number: 002 - 08348 rev. *b page 20 of 22 MB39C326 21. major changes spansion publication number: mb39c 326_ ds405 - 00001 page section change results revision 1.0 - - initial release note: please see document history about later revised information.
document number: 002 - 08348 rev. *b page 21 of 22 MB39C326 document history document title: MB39C326 6mhz synchronous rectification buck - boost dc/dc converter ic document number: 00 2 - 08348 revision ecn orig. of change submission date description of change ** ? taoa 01/31 /201 4 migrated to cypress and assig ned document number 002 - 08348 . no change to document contents or format. *a 5131396 taoa 02/10 /2016 updated to cypress template * b 5732493 hixt 0 5 / 11 /201 7 updated p in a ssignments : added the package name, u4d020 updated o rdering i nformation : change the package name from wlp - 20p - m01 to u4d020 deleted ev board ordering information deleted marking deleted labeling sample eted MB39C326pw recommended conditions of moisture sensitivity level
document number: 002 - 08348 rev.*b may 11, 2017 page 22 of 22 MB39C326 sales, solutions, and legal information worldwide sales and design support cypress mai ntains a worldwide network of offices, solution centers, manufacturers representatives, and distributors. to find the office closest to you, visit us at cypress locations . products arm ? cortex ? microcontrollers cypress.com/arm automotive cypress.com/automotive clocks & buffers cypress.com/clocks interface cypress.com/interface internet of things cypress.com/iot memory cypress.com/memory microcontrollers cypress.com/mcu psoc cypress.com/psoc power management ics cypress.com/pmic touch sensing cypress.com/touch usb controllers cypress.com/usb wi reless/rf cypress.com/wireless psoc ? solutions psoc 1 | psoc 3 | psoc 4 | psoc 5lp | psoc 6 cypress developer community forums | wiced iot forums | projects | video | blogs | training | components technical support cypress.com/support arm and cortex are th e registered trademarks of arm limited in the eu and other countries. ? cypress semiconductor corporation, 2014 - 201 7 . this document is the property of cypress semiconductor corporation and its subsidiaries, including spansion llc (cypress) . this docum ent, including any software or firmware included or referenced in this document (software), is owned by cypress under the intell ectual property laws and treaties of the united states and other countries worldwide. cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrig hts, trademarks, or other intellectual property rights. if the software is not accompanied by a license agreement and you do not o therwise have a written agreement with cypress governing the use of the software, then cypress hereby grants you a personal, non - exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the software (a) for s of tware provided in source code form, to modify and reproduce the software solely for use with cypress hardware products, only intern ally within your organization, and (b) to distribute the software in binary code form externally to end users (either directl y or indirectly through resellers and distributors), solely for use on cypress hardware product units, and (2) under those cl aims of cypresss patents that are infringed by the software (as provided by cypress, unmodified) to make, use, distribute, and imp ort the software solely for use with cypress hardware products. any other use, reproduction, modification, translation, or compilation of the software is prohibited. to the extent permitted by applicable law, cypress makes no warranty of any kind, express or implied, with regard to this document or any software or accompanying hardware, including, but not limited to, the implied warranties of merchantability and fitness for a particul ar purpose. to the extent permitted by applicable law, cypress reserves t he right to make changes to this document without further notice. cypress does not assume any liability arising out of the ap plication or use of any product or circuit described in this document. any information provided in this document, including any sa mple design information or programming code, is provided only for reference purposes. it is the responsibility of the user of this document to properly design, program, and test the functionality and safety of a ny application made of this information and any resulting product. cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the ope ration of weapons, weapons systems, nuclear installations, life - support devices or systems, other m edical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substance s management, or other uses where the failure of the device or system could cause personal injury, death, or property damage (unin tended uses). a critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. cypress i s not liable, in whole or in p art, and you shall and hereby do release cypress from any claim, damage, or other liability arising from or related to all unintended uses of cypress products. you s hall indemnify and hold cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any unintended uses of cypress p roducts. cypress, the cypress logo, spansion, the spansion logo, and combinations thereof, wiced, psoc, capsense, ez - usb, f - ram, an d traveo are trademarks or registered trademarks of cypress in the united states and other countries. for a more complete list of cypress trademarks, visit cypress.com. other names and b rands may be claimed as property of their respective owners.

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